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Half-Year Financial Report 2022

We have published our 1st Half Results 2022 on July 27, 2022 at 7:00 a.m. CEST.

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Virtual Annual Shareholders’ Meeting on April 29, 2022 in the Conference Center at BASF in Ludwigshafen

Annual Shareholders’ Meeting 2022

The Annual Shareholders’ Meeting of BASF SE was held on Friday, April 29, 2022, starting at 10:00 a.m. as an entirely virtual meeting.

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Die Labormitarbeiter testen die Benetzungseigenschaften eines Siliziumwafers, nach der Bearbeitung mit PlanapurÂ®, einem Poliermittel, das Nanopartikel enthÃ¤lt. Mit ihm werden Wafer bei ihrer Herstellung mehrfach glatt geschliffen. Damit ihre OberflÃ¤che dabei keine Kratzer bekommt, mÃ¼ssen die Schleifpartikel extrem fein und klein sein. Als einer der MarktfÃ¼hrer in Asien und Europa verfÃ¼gt BASF Ã¼ber ein groÃ es Know-how im Bereitstellen von Prozesschemikalien und LÃ¶sungen fÃ¼r die Halbleiterindustrie.
Abdruck honorarfrei. Copyright by BASF.

The lab technicians test the wetting properties of a silicon wafer after it has been treated with PlanapurÂ®, a polishing material that contains nanoparticles. Wafers are polished with PlanapurÂ® several times during manufacture. To ensure that no scratches develop on their surface, the grinding particles must be extremely small and fine. As a leading market player in Asia and Europe, BASF has strong expertise in delivering process chemicals and solutions for the semiconductor industry.
Print free of charge. Copyright by BASF.,Die Labormitarbeiter testen die Benetzungseigenschaften eines Siliziumwafers, nach der Bearbeitung mit Planapur®, einem Poliermittel, das Nanopartikel enthält. Mit ihm werden Wafer bei ihrer Herstellung mehrfach glatt geschliffen. Damit ihre Oberfläche dabei keine Kratzer bekommt, müssen die Schleifpartikel extrem fein und klein sein. Als einer der Marktführer in Asien und Europa verfügt BASF über ein großes Know-how im Bereitstellen von Prozesschemikalien und Lösungen für die Halbleiterindustrie.
Abdruck honorarfrei. Copyright by BASF.

The lab technicians test the wetting properties of a silicon wafer after it has been treated with Planapur®, a polishing material that contains nanoparticles. Wafers are polished with Planapur® several times during manufacture. To ensure that no scratches develop on their surface, the grinding particles must be extremely small and fine. As a leading market player in Asia and Europe, BASF has strong expertise in delivering process chemicals and solutions for the semiconductor industry.
Print free of charge. Copyright by BASF.

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Hu Wenkui, steam cracker operator, conducts a routine inspection of the platform of the cold fraction. This fraction has the largest number of columns and exchangers. It also has three compressor systems: ethylene refrigeration system and propylene refrigeration system and heat pump system.

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