News Releases

Results: 870

Trade News | October 21, 2026

BASF unveils “Future Unlocked” at in-cosmetics Asia 2026

At in-cosmetics Asia 2026, BASF will bring its theme "Beyond Beauty: Future Unlocked" to life through a showcase of science-driven innovation, formulation expertise, and market insights.
Jens Liebermann (right), Senior Vice President, Global Electronic Materials business and Chairman of BASF Taiwan, signed the Letter of Intent (LOI) with Ming-Hsin Kung (left), Taiwan’s Minister of Economic Affairs, at the 2026 Taiwan Business Alliance Conference, highlighting BASF's long-term commitment to Taiwan's semiconductor ecosystem.

Photo resource: Taiwan’s Ministry of Economic Affairs
October 20, 2026

BASF signs Letter of Intent with Taiwan’s Ministry of Economic Affairs to advance next-generation semiconductor manufacturing 

BASF today signed a Letter of Intent (LOI) with Taiwan’s Ministry of Economic Affairs (MOEA), underscoring its long-term commitment to supporting the growth of Taiwan’s semiconductor ecosystem. Through this investment, BASF’s Electronic Materials business is expanding its Kuanyin site in Taoyuan with additional production capacity for advanced semiconductor materials, enhanced quality analysis capabilities, and an expanded Innovation Center.
October 14, 2026

Reliably Cooled: BASF launches GLYTHERMIN® for data centers of the future

Ludwigshafen, Germany, October 8, 2026 – The rapid growth of artificial intelligence (AI) and cloud computing is driving the expansion of data centers around the world and creating new challenges for operators in energy efficiency and thermal management. With its Glythermin product platform, BASF offers high-performance heat transfer fluids for modern liquid-cooled data centers, supporting the reliable operation of AI infrastructure.
Because of its extraordinary property profile Ultrason® is ideally suited for E&E parts in AI infrastructure like fiber optical connectors (FOC).
Photo: BASF
Trade News | October 12, 2026

Powering data, managing heat: Ultrason® for AI-driven E&E applications

BASF is expanding the application focus of its Ultrason® portfolio to advance the development of electrical and electronic (E&E) components used in AI-driven data centers, high-speed connectivity and e-mobility. BASF’s polyarylethersulfones (PAES) thus support E&E manufacturers, OEMs and data center operators who require materials that maintain reliable operation, signal integrity and long service life as well as ensure fire safety and efficient thermal management. 
Business & Financial News | September 25, 2026

BASF confirms exploratory talks regarding potential takeover of Evonik

BASF SE (BASF) confirms exploratory talks with RAG-Stiftung and Evonik Industries AG (Evonik) regarding a potential takeover of Evonik. The course and outcome of these exploratory talks remain open at this stage.